Products
Cleaning / Etching
EMK Electronic Materials
CLEANING / ETCHING
With the understanding that the industry is continuing its relentless drive to smaller geometries and greater complexity, we are committed to deliver highest purity (PPT level) and precision-based electronic-grade chemicals. We offer a broad range of wet chemistry products including
Solvent: PGME, PGMEA, NMP, DMSO, Cyclopentanone, Cyclohexanone, Methanol, IPA, Acetone, Ethyl Glycol
Acid: H2SO4, H3PO4, HCl, HNO3, CH3COOH, HF
Alkaline: NH4OH, KOH, NaOH, K2CO3
Oxidant: H2O2
Etchant: Al etch, Ti etch, Cu etch, Spin Etch. We provide tunable solutions for every specific performance requirement.
Photolithography & Ancillaries
EMK Electronic Materials
PHOTORESIST
(1) Photoresists for Integrated Circuit (IC) Device Fabrication
- TR series: High-purity and conformance to the most stringent wafer fabrication, our positive resist products are well-suited for application above ~130 nm Al-line technology.
(2) Photoresists for Advanced Wafer Level Packaging
Grounded on a group of high-sensitivity and high-resolution photoresists for flip-chip interconnect technology, we always work closely with customers to maximize our resists’ performance to meet each of their specific demands.
- PR4000 series: Positive resists for Au/Cu/NiFe-electroplating (redistribution layer, RDL, and under bump metallization, UBM) on different types of substrate materials, e.g. customized PR4000 series outperform market brands, achieving superior taper profile and plating quality.
- TC200 series: Aligning to the ever-evolving semiconductor technology, this thick resist series are aptly designed for micro-bumping (Cu/Ni/SnAg/SnAu-pillar), enabling desirable thickness of 30~100 μm in single coat.
Projected for flat panel displays, these resists come with outstanding lithography patterning performance to build consumer electronic devices which has been booming in volume over the last decades.
- RBE series: Negative lift-off resists withstanding even the harshest metal thin film-sputtering/evaporation that requires robust control of resist profile.
- CRK series: High optical-density (OD) and high impedance negative resists for LCD industry application.
- RGB series: High contrasting and high penetration negative resists as excellent color filters for uses in thin-film-transistor-liquid-crystal-displays (TFT-LCD) and organic light-emitting-devices (OLED).
- SR series: Negative resists showing high penetration, fast elastic recovery, high Voltage-Holding-Ratio (VHR) and good heat/chemical-resistancy to stabilize material thickness e.g. control of liquid crystal thickness in LCD manufacturing best
- PF series: Negative organic insulating-resists possessing pyrolysis temperature > 350 °C. Their fine resolution & sturdiness enable extended application as a planarization layer, protective layer or interlayer insulation film in advanced TFT manufacturing process and touch panels buildup.
Remark: Above Photoresists are CMC Products.
PHOTORESIST (PR) & Polyimide (PI) Ancillaries
| 2.38% TMAH Tetramethylammonium hydroxide (TMAH) based developer for photoresist (PR) after exposure process. |
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| Advanced TMAH Tetramethylammonium hydroxide (TMAH) based photoresist developer specially designed to prevent attack of sensitive metals (much lower metal etching rate), while with good developing performance. |
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| EMK 400K Potassium-based alkaline photoresist developer (aqueous). Odourless and colourless liquid is designed to achieve utmost contrast and best wall profile together with photoresists at high coating thickness. |
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EBR 7030 A solvent mixture for edge-bead removal (EBR) and wafer backside rinse after photoresist spin coat. By controlling spin speed, nozzle position, and nozzle direction, the resist edge bead is removed effectively. |
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| EMK 515 Cyclopentanone-based solvent for polyimide developer after exposure. Pre-wet solvent for reduced resist consumption (RRC). |
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| EMK 430 A solvent mixture for polyimide developer after exposure. Pre-wet solvent for reduced resist consumption (RRC). |
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| EMK 350 Pre-wet solvent for reduced resist consumption (RRC), for 28 nm front-end process. |
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| EMK 260 PGMEA-based solvent for rinse after polyimide developer. Pre-wet solvent for reduced resist consumption (RRC). |
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| EMK 1900 A specially formulated chemical for polyimide (PI) rework remover before PI cure process. The chemical has good compatibility with Cu and Al pad. |
Photoresist Stripper
EMK Electronic Materials
Photoresist Stripper
- EMK 9600
A uniquely formulated photoresist (PR) remover for stripping thick and thin photoresist (dry film or liquid PR), used in Wafer Level Packaging, Solder Bumping, Solder plating, Cu Pillar, RDL, UBM plating, dry etch process. Can effectively remove both of positive and negative photoresist, either in spray equipment or wet bench process.
- EMK 9800
EMK 9800 is specifically designed to prevent attack of sensitive metals (much lower metal etching rate), while with good stripping performance for thick and thin resist (dry film or liquid PR), can effectively remove both of positive and negative photoresist.
- EMK 9630
A low-cost photoresist (PR) remover with good stripping performance for thick and thin resist (dry film or liquid PR). Can effectively remove both of positive photoresist and negative photoresist.
- EMK 4830
A specifically formulated positive photoresist (PR) remover for stripping thick and thin photoresist, with high bath loading and fast stripping performance in spray equipment or wet bench process.
- EMK 1900
A specially formulated chemical for polyimide (PI) rework remover before PI cure process. The chemical has good compatibility with Cu and Al pad.
Post-Etch Residue Removers
EMK Electronic Materials
Post-Etch Residue (PER) Removers
- EMK 8500
A post-etch residue (PER) remover for via, DRIE etch, metal etch process, with high stripping efficiency against the organic and inorganic sidewall polymer, photoresist residue after DRIE etch and oxygen plasma ashing.
- EMK 8504
EMK 8504 is specifically designed to remove post-etch residue (side-wall polymer) and plasma-harden photoresist in one stripping process. Thus, the oxygen plasma ashing process can be avoided.
- EMK 8700
A uniquely formulated post-etch residue remover for inorganic, organometallic, metal etch residue when multi-metal layer (Cu/Al) was involved during DRIE etch process. The chemical has good compatibility with Ti, Ni, W.
- EMK 8110
Is a fluoride-containing stripper specifically designed for removal of inorganic, organometallic and highly oxidized etch residue.
Advanced Chemicals
EMK Electronic Materials
Advanced Chemicals
Our innovative technologies go beyond conventional generic products for various applications such as wafer cleaning, etching, stripping or developing. We are continually creating new formulations that enable greater process control to meet the increasingly stringent requirements of the leading-edge technologies.
Selective Etching – Advanced Developer, Etchant, Cleaning Chemical
Ultimate precision and nanometer-level selective etch control are the performance goals for today’s leading-edge etch processes. To achieve these complex selectivity goals, our expertise has developed a novel formulation of engineered etching performance chemistries offering new levels of etch control, combined with a more efficient approach.
Other Specialty Chemicals
EMK Electronic Materials
Laser Grooving Liquid
LD series
Water-soluble, non-corrosive protective coating materials which is designed specifically for the ultraviolet- and infra-red laser grooving process in Outsource-Semiconductor Assembly Technology (OSAT).
- Optimized formulation to prevent thermal adhesion of debris, materials peeling / de-lamination, or PI-burning on chips
- Improved lubricity during grooving process while leaving no ionic or organic contamination on die surface even after prolong hours of coating
Reliability-Proven of LD series Grooving Liquid in WLCSP
Reliability-Proven of LD series grooving liquid in Assembly Engineering
EMK 6401
- A uniquely formulated solvent mixture for effective cleaning of Cu-bond pad from oxides, chlorine and organic residues contaminant in semiconductor & assembly packaging.
General / Lab Reagents
EMK Electronic Materials
GENERAL / LAB REAGENTS
With the understanding that the industry is continuing its relentless drive to smaller geometries and greater complexity, we are committed to deliver highest purity (PPT level) and precision-based electronic-grade chemicals. We offer a broad range of wet chemistry products including
Solvent: PGME, PGMEA, NMP, DMSO, Cyclopentanone, Cyclohexanone, Methanol, IPA, Acetone, Ethyl Glycol
Acid: H2SO4, H3PO4, HCl, HNO3, CH3COOH, HF
Alkaline: NH4OH, KOH, NaOH, K2CO3
Oxidant: H2O2
Etchant: Al etch, Ti etch, Cu etch, Spin Etch. We provide tunable solutions for every specific performance requirement.